Service Engineer - Semiconductor Equipment

apartmentReeracoen Recruitment placeChoa Chu Kang scheduleFull-time calendar_month 
Service Engineer - Semiconductor Equipment (Ref: 37027)

Salary: S$4,000 - S$6,300

Our client is one of the biggest Japanese Manufacturers. Currently, they are looking for a Service Engineer.

This role is part of a global engineering team supporting advanced equipment solutions within the semiconductor industry. As a Service Engineer, you will play a critical role in ensuring optimal performance and reliability of equipment at customer sites.

You will be responsible for installation, troubleshooting, and after-sales technical support, while working closely with customers to minimize downtime and improve operational efficiency. This is a hands-on, customer-facing position suited for engineers who enjoy problem-solving in a fast-paced manufacturing environment and are keen to deepen their expertise in semiconductor equipment technologies.

【Responsibilities】
  • Conduct on‐site installation and commission of equipment
  • Conduct technical training on the operation, set‐up, and maintenance of equipment at the site
  • Perform troubleshooting on semiconductor equipment
  • Provide after-sales technical field service for equipment
  • Prepare quotations and coordinate sales and service activities
  • Building good rapport and customer relationships
  • Assess customers’ needs and suggest appropriate equipment and response to customer enquiries.
  • Identify, promote, and create any potential leads for materials opportunities, and sales realization with the team.
【What you will receive】
  • AWS
  • Variable Bonus (based on company and individual performance)
  • Annual leave: 14 days (increasing by 1 day per year, up to 21 days)
  • Medical benefits
  • Transport allowance (reimbursable)
  • Hybrid working arrangement
【Requirements & Preferences】
(Must)
  • Diploma in Electronics, Mechanical Engineering, or equivalent
  • Minimum 5 years of hands-on experience servicing semiconductor equipment, such as:
  1. Pre-assembly / back-end processes (e.g., die attach, wire bonding, molding, inspection), or
  2. Front-end equipment (etch, deposition, lithography)
  • Possess a valid Class 3 driving license
  • Willing to travel to Japan or the South Asia region when required
  • Strong troubleshooting skills in electro-mechanical systems, PLCs, sensors, and automation equipment
  • Willing to travel (if required) and respond to urgent service calls
  • Excellent communication in both English and Mandarin to liaise with English and Mandarin stakeholders
(Advantageous)
  • Prior experience in wafer fabs, OSATs, or semiconductor manufacturing environments is highly preferred
  • Available to start on short notice
  • Experience working in a Japanese company

We regret that only shortlisted candidates will be notified.

Registration No.: R1874034 (Niltasha Binte Ibrahim)

Recruitment Licence: 12C5051

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