Plating Process Engineer

The Opportunity:

Adecco is partnering with a premier supplier of high-quality Flip Chip Ball Grid Array (FC-BGA) substrates in search of Plating Process Engineer to join their organization.

The Job:

• Develop and optimize plating processes (e.g., electrolytic copper, Ni/Sn).
• Evaluate new chemicals, materials, and equipment for plating process enhancement.
• Establish plating parameters to ensure uniform thickness, adhesion, and reliability.

• Monitor plating bath chemistry and maintain proper control limits.
• Implement Statistical Process Control (SPC) and DOE to analyze process capability.
• Troubleshoot process and equipment issues to improve yield and throughput.

• Conduct root cause analysis of plating defects.
• Work with quality and reliability teams to address substrate failure mechanisms.
• Drive continuous improvement initiatives to enhance quality and cost efficiency.

• Interface with design, manufacturing, equipment, and suppliers to meet production goals.
• Support new product introductions (NPI) and qualification of plating processes.

• Maintain detailed documentation of plating recipes, process controls, and specs.
• Ensure compliance with environmental, safety, and regulatory standards (e.g., RoHS, REACH).

The Talent:

• PhD or Master's degree in Chemical Engineering, Materials Science, or related field.
• 5-10+ years of experience in semiconductor packaging or PCB/substrate manufacturing.
• Hands-on experience with copper/nickel/tin plating processes.
• Familiarity with tools such as XRF, SEM, profilometer, and electroplating equipment.
• Knowledge of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding is a plus.
• Knowledge of surface treatment, adhesion promotion, and via filling techniques.
• Familiar with lean manufacturing, Six Sigma, or SPC tools.

Next Steps:

• Prepare your updated resume (please include your current salary package with a full breakdown such as base, incentives, annual wage supplement, etc.) and expected package.
• Apply through this application or send your resume to [email protected] in MS Word Copy. We'd love to hear from you!
• We regret that only shortlisted candidates will be notified.

Personnel Registration Number: R11011456