Senior Field Applications Engineer

RESPONSIBILITIES :

• Understand customer's problems (needs and wants), design and recommends solutions to meet their needs and ensures customer satisfaction.
• Lead the design/delivery of TCI (Test Cell Integration) or multiple technologies solutions.
• Prepare training documents to both in-house engineers and customer training needs.
• Conduct relevant application support service trainings and co-trainer in customer training.
• Able to lead a project team to accomplish projects in a timely manner.
• Holding key customer account and manages projects together with factory engineering to meet customer’s needs in both technical requirements and time schedule.
• Understands and applies Solution Planning & Implementation standards.
• Build and establish strong relationships with factory to co-develop solutions to IPG related problems.
• To be effectively identifying design related problems and suggest necessary changes to the factory through an orderly reporting manner.
• Take initiative to own and solve specific customer issues.

REQUIREMENTS AND QUALIFICATIONS :

• At least 4 years relevant experience.
• Good knowledge of semiconductor assembly and test industry. Preferably have experiences developing test programs or have supported test applications on at least one of the following product or technologies; Advantest, Verigy, LTX-Credence, Teradyne, MEMs testing, load board design and sockets.
• Good knowledge of test sockets (Contactors) design concept.
• Loadboard/Probecard design requirements and debugging.
• Flexibility and willingness to travel and support customers globally.
• Minimum Bachelor Degree or equivalent in electronics and electrical engineering from a recognized university.
• Good command of written and spoken English with strong interpersonal skills.
• Knowledge of using MS Office (Words, Excel & PowerPoint) is mandatory.
• Added advantage with knowledge of CAD software (AutoCAD, SolidWorks).
• Able to start work at short notice.