R&D Scientist – Co-Packaged Optics (NSTIC), IME - Toa Payoh

Job Description:

• Development of package-level optical interconnects for advanced Co-Packaged Optics (CPO) platforms using fan-out, silicon interposers, polymer, glass, or 3D stack technologies, interfacing with various optical coupling schemes.
• Simulate the impact of hybrid bonding interfaces, package stacks and other packaging elements on optical signal transmission.
• Design silicon and alternative-material lenses for optical I/Os in wafer-scale integration.
• Estimate optical losses between grating/edge couplers and fiber interfaces via lens structures.
• Design package level/wafer-level optical interconnects between GPU–GPU and GPU–memory for multi-chiplet heterogeneous integration packages.
• Develop passive fiber alignment structures and techniques for high-density optical coupling.
• Evaluate fiber array assemblies with CPO test vehicles.
• Generate package design and test plans to prototype and validate process flows.
• Characterize fabricated structures using optical testing and metrology tools.
• Propose innovative ideas to improve the state of the art in optical interconnects and testing.

Job Requirements:

• MS or Ph.D in Engineering or Physics.
• Strong background in optical interconnect modeling.
• Understanding of passive alignment techniques for fiber-to-chip coupling. (V-grooves, alignment pins, trench structures, etc.)
• Understanding of optical loss mechanisms, alignment tolerances, and packaging-induced misalignments.
• Knowledge in wafer-level processes such as lithography, DRIE, plasma etching, wafer bonding, and dicing.
• Familiarity with photonic packaging platforms (SiPh, InP, TFLN) and coupling interfaces (edge coupler, grating coupler).
• Proficiency with microscope-based alignment, metrology, and optical loss measurements.
• Strong communication, teamwork, and technical reporting skills.