Associate Engineer (Equipment Engineering) - Yishun

All Modules: Photolithography / Pre-assembly / Reconstitution / Thin Film / Wet Etch / Tape & Reel / Back Grind / Backend

Key Job Accountabilities (Actual daily deliverables):

• Perform set-up and conversion to support production.
• Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts.
• Determine methods and procedures independently and provide guidance to less experienced team members when required.
• Communicate with Engineers and external vendors to resolve problems and provide advanced training to less experienced Technical Specialists.
• Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.

Required Qualifications:

• Diploma in Mechanical Engineering, Physics, Chemical, Material Sciences or equivalent.
• 2 years of relevant experience in wafer bumping or wafer fabrication are preferred otherwise candidates without experience are welcomed to apply as training will be provided.
• Ability to work on 12 hours rotating shift.