The Supreme HR Advisory Pte Ltd - Senior Process Engineer (Thermo Compression Bonding)

apartmentThe Supreme HR Advisory placeSembawang scheduleFull-time calendar_month 

Position title : TCB (Thermo Compression Bonding) Process Engineer

Location: Admirax St (Nearest MRT: Sembawang)
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $5000 - $8000 (depends experience)
  • Responsibilities:
  • Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding.
  • Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability.
  • Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage.
  • Define and maintain process documentation, control plans, and standard operating procedures (SOPs).
  • Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements.
  • Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature/power controls).
  • Support NPI (New Product Introduction) and technology transfers from R&D to production.
  • Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis.
  • Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring.
  • Maintain compliance with environmental, health, and safety standards.
  • Experience on HBM, COWOS, 2.5D is a definite plus
  • Experience on N2 Environment is added advantage

Requirements:

  • Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
  • Experience with TCB or similar bonding technologies (thermo-sonic, thermocompression, eutectic bonding) is highly preferred.

Samuel Siaw

The Supreme HR Advisory Pte Ltd

EA No: 14C7279

Reg No: R24124745

electric_boltImmediate start

Process Engineer - Sembawang

apartmentOIP TECHNOLOGY PTE. LTD.placeSembawang
A start-up hi-tech company has immediate openings for : PROCESS ENGINEER | ANG MO KIO |  •  5 days Roles & Responsibilities  •  Set up molding and laser-pattern process  •  Designing and testing process upgrades and new process systems.  •  Ensuring...
apartmentThe Supreme HR AdvisoryplaceSembawang
Position title : TCB (Thermo Compression Bonding) Process Engineer Location: Admirax St Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $5000 - $8000 (depends experience) Responsibilities:  •  Develop and optimize TCB process...
apartmentThe Supreme HR AdvisoryplaceSembawang
Consultant to match you with our Clients. No Charges will be incurred by Candidates for any service rendered. WA 88824667 for more Process Engineer roles   1.  TCB (Thermo Compression Bonding) Process Engineer Location: Admirax St Working Days: 5 Day A Week...