Toa Payoh - Product Specialist (Process & Equipment) | Semiconductor

Job Description

• Provides support for Thermal Compression (TC) product setup & demo
• Conducts feasibility studies, sample bonding and generate report
• Builds-up technical know-how on product/problem solving via structured knowledge transfer between the on-site support team, the Product Line and the R&D team
• Defines DOE’s and experimental process trials & collects Process Data
• Scouts and reports new product ideas and innovation with the goal to enhance the product related to thermal compression bonding
• Understands the Thermal compression bonding process from Physics/Chemistry point of view and relate to actual bonding
• Acquires knowledge on pre and post die bonding processes
• Provides suggestions based on analysis of results, knowledge
• collection from papers/journals/books/publications and customer
• discussions to improve process or provide solutions to problems
• Engages in R&D projects during product definition / requirement engineering, SW test and customer product testing
• Understands the different process for thermal compression bonding (C2S, C2W, Flux or Fluxless)
• Deep dive and troubleshoot process related or equipment related to issues and suggest improvements in HW design/SW logic
• Defines SW requirements for new modules and features/Process sequence and Data/information exchange with different stakeholders.
• Collects process / production / competitor data at customer site
• Supports SOP, technical documentation and product operating manual writing activities and publish BKM

• Conducts evaluations, demos and generate test report and instructions
• Support Sales and CPMs during Pre-Sales and demo activities
• Establishes good customer relationship on technical level with key accounts assigned
• Provides Technical Info to CPMs/Sales and/or product group.

• Coordinates and provides technical solutions / problems solving on customer issues in collaboration with Field Service Engineer
• Investigates issues at customer site and supports Engineering team for fast and short time to solution
• Provide application support for internal & external customers
• Conducts training to FSE’s and Customers

Requirements

• Degree/Masters in Mechanical/Electrical/Electronics or Mechatronic Engineering

• Minimum 5 years of experience in a complex Technical environment and 3 years in Product Support environment & RnD support
• Experience in production environment on Die attach/die bonding know.
• Hands-on experience in semiconductor front end or backend Process and equipment

• Good PC, MS-Office, AutoCad knowledge
• Matlab, JMP and statistical data analysis skills desirable
• Excellent wafer fab Front end/Backend Metrology knowledge

• Very analytical skills
• Excellent communication skills
• High level of assertiveness
• High degree of flexibility required
• Travel requirement