Associate Engineer, Equipment (Die Prep/Recon)

Position Summary

The Equipment Associate Engineer (DP/ Recon) is responsible for performing maintenance and repairs on the assigned equipment. The ideal candidate is a good team player, able to work independently, attentive to details and safety, and willing to embrace new task or responsibilities in a dynamic environment.

• Perform equipment Line Sustaining function (corrective maintenance), preventive maintenance, predictive maintenance, and calibration.
• Sustain and improve overall equipment performance (OEE).
• Update consumables/spare parts to ensure no delay in machine recovery due to no spare.
• Participate and contribute to continuous improvement activities for yield, maintenance cost, equipment modification and productivity improvement.
• Assist Engineers in setting up new machine and buy-off.
• Maintain good housekeeping and safety practices in the cleanroom.
• Communicate with supervisors, fellow shift personnel and vendors to resolve problems.
• Timely update and ensure data integrity of pass down report, PM Checklist and other similar reports, checklists and documents.
• Comply safety standards and procedures during shift duty or working in the production line.
• Responsible for maintenance and repairs on the assigned equipment.
• Provide line sustaining supports to manufacturing such as machine conversion, device setup and jig and tool maintenance.
• Perform, update and document equipment preventive maintenance in-accordance to process and equipment specification.
• Support engineering group on device and recipe creation, equipment buy-off, evaluation, qualification and new product introduction.
• Any other ad-hoc duties as assigned.

• Diploma in Electrical/ Electronics/ Mechanical/ Mechatronics/ Chemical/ Material Science or equivalent.
• Minimum 3 years’ relevant experience in semiconductor/ LCD/ electronics/ electrical industry.
• Minimum 3 years’ experience in maintenance and troubleshooting of equipment, preferably in semiconductor backend operations.
• Has hands-on experience in handling equipment for any of the following: Carrier Lamination, Pick and Place, Wafer Saw, Wafer Backgrind, Laser grooving, Wafer Mounting, Taping and Detaping, Molding (Compression, Transfer, or Injection).
• Able to work in both day and night rotating shifts, and flexible to work under various shift patterns.