CMP Process Engineer

The Opportunity:

Adecco is partnering with a premier supplier of high-quality Flip Chip Ball Grid Array (FC-BGA) substrates in search of CMP Process Engineer to join their organization.

The Job:

• Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric, etc.) in advanced substrate manufacturing.
• Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness.

• Define equipment specifications and validate CMP tools.
• Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies.

• Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination).
• Implement process monitoring techniques like thickness metrology (e.g., ellipsometry, profilometry) and defect inspection.

• Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration.
• Support the development of process flows for advanced packaging substrates including SAP/ Damascene, ABF/PI/PID-based technologies.

• Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters.
• Document standard operating procedures (SOPs), work instructions, and control plans.

• Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI).
• Assist with customer qualifications and reliability testing as needed.

The Talent:

• PhD or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, or a related field.
• 5-10+ years of experience in CMP process development in semiconductor packaging, wafer fabrication, or substrate manufacturing.
• Hands-on experience with CMP tools.
• Solid understanding of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding.
• Experience with defect analysis tools (e.g., optical inspection, SEM, AFM).
• Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers).
• Knowledge of slurry chemistry, pad materials, and post-CMP cleaning processes.

Next Steps:

• Prepare your updated resume (please include your current salary package with a full breakdown such as base, incentives, annual wage supplement, etc.) and expected package.
• Apply through this application or send your resume to hui••••••••@adecco.com in MS Word Copy. We'd love to hear from you!
• We regret that only shortlisted candidates will be notified.

Personnel Registration Number: R11011456