ThermoCompression Bonding Process Engineer (TCB / Semiconductor ) - Yishun

Salary : $5000 - $8000 (depends experience)

Responsibilities:

• Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding.
• Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability.
• Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage.
• Define and maintain process documentation, control plans, and standard operating procedures (SOPs).
• Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements.
• Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature/power controls).
• Support NPI (New Product Introduction) and technology transfers from R&D to production.
• Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis.
• Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring.
• Maintain compliance with environmental, health, and safety standards.
• Experience on HBM, COWOS, 2.5D is a definite plus
• Experience on N2 Environment is added advantage

Requirements:

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
• Experience with TCB or similar bonding technologies (thermo-sonic, thermocompression, eutectic bonding) is highly preferred.

The Supreme HR Advisory Pte Ltd EA No: 14C7279