Field Application Engineer

apartmentKULICKE & SOFFA PTE. LTD. placeYishun descriptionPermanent calendar_month 

The successful candidate will be part of a multi-site Kulicke & Soffa (K&S) team responsible for the development, deployment, and sustainment of semiconductor assembly equipment.

The Application Engineer will provide technical and application support for K&S Clip Attach assembly equipment at customer sites, including Die Attach Bonders, Clip Attach Bonders, and Vacuum Reflow Ovens.

This role requires close collaboration with internal cross-functional teams (engineering, manufacturing, sales, and marketing) as well as external customers and suppliers to support product performance, customer adoption, and continuous improvement initiatives.

Responsibilities:

  • Plan, manage, and execute customer demonstrations and benchmarking activities at customer sites to support sales initiatives and technical evaluations.
  • Support new product introduction (NPI) projects, including process characterization, beta testing, and evaluation tool development.
  • Develop, document, and maintain application solutions and deliverables aligned with the Business Management Model (BKM) to support standardized processes, knowledge management, and continuous improvement initiatives.
  • Provide timely, high‑quality technical support in response to customer requests, ensuring clear, professional, and effective communication.

Qualifications:

  • Bachelor’s or Master’s degree in Engineering, Physics, Materials Science, or a closely related discipline.
  • At least 5 years of relevant, hands‑on experience in backend semiconductor assembly, including assembly packaging processes and equipment maintenance and troubleshooting.
  • Ability to travel frequently in support of business and operational requirements (estimated travel exceeding 70%).
  • Ability to perform job‑related communication with engineers and stakeholders based in China, including coordination with customers, design engineers, and managers.
  • Demonstrated technical knowledge of backend assembly processes, including Die Attach, Flip Module, Clip Attach, and Vacuum Reflow Oven processes.
  • Proven experience in applying Design of Experiments (DOE) and statistical analysis techniques for process optimization and problem solving.
  • Effective verbal and written communication skills to support cross‑functional and cross‑regional collaboration.
  • Demonstrated analytical and problem‑solving capabilities, including the ability to propose practical and innovative solutions.
  • Ability to work collaboratively in cross‑functional teams as well as independently with minimal supervision.
  • Strong results orientation, with the ability to manage priorities and deliver outcomes in a dynamic environment.
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