Application Engineer (Dicer/ Grinder/ Laser) - Bukit Merah

• Ubi Avenue
• Basic + AWS + VB

Job Description:

• Grinder Process development support for customer
• Perform in house application test cut and on site customer support
• Process development support to customer
• Process customer claim for abrasive product
• Good knowledge on blade / wheel / Laser technical support
• Required technical understanding
• Participate in company organized activities
• Promote good interdepartmental relationship
• Establish and maintaining good relationship with customers
• Communicate frequently with Engineer from Japan

Job Requirements:

• Dicer / Grinder/ Laser knowledge / experience is preferred
• Diploma in Mechanical, Electronic or any other engineering disciplines
• 1 - 2 years relevant working experience preferably in semiconductor industry
• Proficient in MS office – Powerpoint / Excel
• Willing to travel
• Pro-active, people & team-oriented

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