Staff Process Engineer, Advanced Solutions (Die Attach / Flip Chip / TCB)

apartmentAdecco placeToa Payoh scheduleFull-time calendar_month18/5/26

Adecco is partnering with a global leader in semiconductor packaging and electronic assembly solutions, seeking a senior process engineer (DA/FC/TVB).

The Job

The process engineer works holistically as the key interface personnel between customer and multidisciplinary engineering teams, providing turnkey solution by maximizing the capability of the machine.

Responsibilities

Test, troubleshoot and optimize processes on highly advanced semiconductor packaging equipment.

Identify areas for technical improvement and gaps in performance
Identifies, analyzes and resolves system design weaknesses
Conduct machine buy-offs in K&S factory and, at times, at customer site
Analyze machine and process data to identify causes of process assists,

failures or yield loss

Serve as technical interface to customers
Preparation of internal summary reports and customer presentations
Provides multi-layered technical expertise for next generation initiatives
Interfaces with other functional groups for troubleshooting and equipment

improvement

Requirements

At least 5 to 10 years of relevant working experience.

Bachelor / Master / PhD in Engineering field (Mechanical, Electrical,

Mechatronics) or related field.

Strong aptitude and deep understanding of highly advanced machinery.
Experience with flip chip, die attach or thermocompression bonding highly

preferred.

Strong data analysis skills, including working knowledge of Matlab and/or

JMP, Minitab; * Ability to travel locally and internationally about 50%, sometime more

frequently

Edric How

Direct Line: +65 •••• •627
EA License No: 91C2918

Personnel Registration Number: R23119149

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